Affiliation of Author(s):机械工程学院
Journal:Materials Science in Semiconductor Processing
First Author:刘腾云
Document Code:BE686C05348B42648B1B38DE110EA0B8
Volume:120
Number of Words:20
Translation or Not:no
Date of Publication:2020-12-01
Date of Publication:2020-12-01
毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
A new method of determining the slicing parameters for fixed diamond wire saw
Date of Publication:2020-12-01 Hits: