Release Time:2021-10-06 |
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw
Institution:机械工程学院
Title of Paper:Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw
Journal:Materials Science in Semiconductor Processing
First Author:李宗强
Document Code:0B1FBBB2738946ABA2509E956D799ADF
Volume:133
Number of Words:10
Translation or Not:No
Date of Publication:2021-07