山东大学教师主页毕文波 Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing Home

Personal Information

Degree:Doctoral Degree in Engineering
Status:Employed
School/Department:机械工程学院

Gender:Male

Education Level:Postgraduate (Doctoral)

Alma Mater:山东大学

Current position: Home / Scientific Research / Paper Publications

Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing

Release Time:2022-05-18 | Hits:

Institution:机械工程学院

Title of Paper:Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing

Journal:Solar Energy

First Author:郑金涛

Document Code:ADB8B134D29341B4B40B6DA28AF9A450

Volume:231

Page Number:343

Number of Words:50

Translation or Not:No

Date of Publication:2022-01