毕文波
+
Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [101] 高玉飞 , 毕文波 and 葛培琪. Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing. Advanced Materials research, 1027, 28, 2014.
- [102] 高玉飞 , 葛培琪 and 毕文波. KDP晶体金刚石线锯切割表面缺陷分析. 《人工晶体学报》, 42, 1278, 2013.
- [103] 高玉飞 , 毕文波 and 葛培琪. KDP晶体锯切应力场与初始内应力场的耦合分析. 《人工晶体学报》, 42, 1504, 2013.
- [104] 张磊 , 毕文波 and 葛培琪. 平面磨削淬硬薄工件磨削力研究. 《农业机械学报》, 43, 231, 2012.
- [105] 高玉飞 , 毕文波 and 葛培琪. KDP晶体缺陷对线锯切割应力分布的影响. 《人工晶体学报》, 42, 2241, 2013.
- [106] 毕文波 and 张磊. An Approximate Solution of Energy Partition in Grind-hardening Process. Advanced Materials research, 135, 298, 2010.
- [107] 高玉飞 , 毕文波 and 张磊. Simulation and Prediction Studies on Harden penetration Depth of AISI 5140 Alloy Steel in Surface Grinding. Applied mechanics and materials, 29-32, 1898, 2010.
- [108] 高玉飞 , 葛培琪 , 张磊 and 毕文波. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceramic International, 45, 7524, 2019.
- [109] 张磊 , 毕文波 , 高玉飞 and 葛培琪. The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon. Materials Science in Semiconductor Processing, 91, 316, 2019.
- [110] 朱洪涛 , 黄传真 , 毕文波 and 葛梦然. Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments. Materials Science in Semiconductor Processing, 74, 261, 2018.