毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [101] gaoyufei , biwenbo and GE PEI QI. KDP晶体缺陷对线锯切割应力分布的影响. 《人工晶体学报》, 42, 2241, 2013.
- [102] biwenbo and 张磊. An Approximate Solution of Energy Partition in Grind-hardening Process. Advanced Materials research, 135, 298, 2010.
- [103] gaoyufei , biwenbo and 张磊. Simulation and Prediction Studies on Harden penetration Depth of AISI 5140 Alloy Steel in Surface Grinding. Applied mechanics and materials, 29-32, 1898, 2010.
- [104] GE PEI QI , zhanglei , biwenbo and gaoyufei. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceramic International, 45, 7524, 2019.
- [105] GE PEI QI , zhanglei , biwenbo and gaoyufei. The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon. Materials Science in Semiconductor Processing, 91, 316, 2019.
- [106] zhuhongtao , huangchuanzhen , biwenbo and 葛梦然. Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments. Materials Science in Semiconductor Processing, 74, 261, 2018.
- [107] GE PEI QI , biwenbo and gaoyufei. 线锯切割晶片翘曲度的影响因素分析. 《工具技术》, 52, 54, 2018.
- [108] gaoyufei , GE PEI QI , biwenbo and 葛梦然. A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. international Journal of Advanced Manufacturing Technology, 91, 2049, 2017.
- [109] GE PEI QI , zhanglei , biwenbo and gaoyufei. Study on the subsurface microcrack damage depth in electroplated diamond wire saw slicing SiC crystal. Ceramics International, 44, 22927, 2018.
- [110] zhanglei , GE PEI QI , gaoyufei , biwenbo and 吴远太. Effects of the micro-structure of arc-shaped groove, rectangular groove and semicircle-based rectangular groove on the reflectance of silicon solar cell. Solar Energy, 158, 617, 2017.