毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [101] GE PEI QI , biwenbo and gaoyufei. KDP晶体金刚石线锯切割表面缺陷分析. 《人工晶体学报》, 42, 1278, 2013.
- [102] gaoyufei , biwenbo and GE PEI QI. KDP晶体锯切应力场与初始内应力场的耦合分析. 《人工晶体学报》, 42, 1504, 2013.
- [103] zhanglei , biwenbo and GE PEI QI. 平面磨削淬硬薄工件磨削力研究. 《农业机械学报》, 43, 231, 2012.
- [104] gaoyufei , biwenbo and GE PEI QI. KDP晶体缺陷对线锯切割应力分布的影响. 《人工晶体学报》, 42, 2241, 2013.
- [105] biwenbo and 张磊. An Approximate Solution of Energy Partition in Grind-hardening Process. Advanced Materials research, 135, 298, 2010.
- [106] gaoyufei , biwenbo and 张磊. Simulation and Prediction Studies on Harden penetration Depth of AISI 5140 Alloy Steel in Surface Grinding. Applied mechanics and materials, 29-32, 1898, 2010.
- [107] GE PEI QI , zhanglei , biwenbo and gaoyufei. Nucleation location and propagation direction of radial and median cracks for brittle material in scratching. Ceramic International, 45, 7524, 2019.
- [108] GE PEI QI , zhanglei , biwenbo and gaoyufei. The Effect of Cut Depth and Distribution for Abrasives on Wafer Surface Morphology in Diamond Wire Sawing of PV Polycrystalline Silicon. Materials Science in Semiconductor Processing, 91, 316, 2019.
- [109] zhuhongtao , huangchuanzhen , biwenbo and 葛梦然. Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments. Materials Science in Semiconductor Processing, 74, 261, 2018.
- [110] GE PEI QI , biwenbo and gaoyufei. 线锯切割晶片翘曲度的影响因素分析. 《工具技术》, 52, 54, 2018.