毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [21] 赵玉康. Machine vision online detection for abrasive protrusion height on the surface of electroplated diamond wire saw. international Journal of Advanced Manufacturing Technology, 2022.
- [22] 王德祥. Grain trajectory and grain workpiece contact analyses for modeling of grinding force and energy partition. international Journal of Advanced Manufacturing Technology, 70, 2111-2123, 2014.
- [23] 葛培琪. 基于机械综合实验的团队教学改革与实践. 实验室研究与探索, 33, 205-208, 2014.
- [24] 魏枫展. 基于3D扫描的逆向建模实验教学研究与实践. 创新创业理论研究与实践, 2022.
- [25] 张莹. The study for variable grinding depth to control plane grind-hardening layer depth distribution. international Journal of Advanced Manufacturing Technology, 84, 1269-1276, 2016.
- [26] 王心雨. 基于数字图像处理技术的白麻花岗岩含水率检测. 《无损检测》, 44, 43, 2022.
- [27] 郑金涛. Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy, 231, 343, 2022.
- [28] 李承云. Thermal simulation of the continuous pulse discharge for electro-spark deposition diamond wire saw. international Journal of Advanced Manufacturing Technology, 119, 2923, 2022.
- [29] 李淑颖. 基于虚拟仿真技术与实际操作相结合的数控加工实验教学设计. 工具技术, 2021.
- [30] 毕文波. An on-line inspection method for abrasive distribution uniformity of electroplated diamond wire saw. Journal of manufacturing processes, 71, 2021.