毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [21] 郑金涛. Transverse forced vibration of a diamond wire under support excitations. International Journal of Mechanical Sciences, 107786, 2023.
- [22] 郑金涛. Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing. Solar Energy, 2022.
- [23] 李承云. Experimental investigations on optimizing manufacturing parameters for electrospark deposition diamond wire saw. International Journal of Advanced Manufacturing Technology, 6523, 2022.
- [24] 赵玉康. Machine vision online detection for abrasive protrusion height on the surface of electroplated diamond wire saw. international Journal of Advanced Manufacturing Technology, 2022.
- [25] 王德祥. Grain trajectory and grain workpiece contact analyses for modeling of grinding force and energy partition. international Journal of Advanced Manufacturing Technology, 70, 2111-2123, 2014.
- [26] 葛培琪. 基于机械综合实验的团队教学改革与实践. 实验室研究与探索, 33, 205-208, 2014.
- [27] 魏枫展. 基于3D扫描的逆向建模实验教学研究与实践. 创新创业理论研究与实践, 2022.
- [28] 张莹. The study for variable grinding depth to control plane grind-hardening layer depth distribution. international Journal of Advanced Manufacturing Technology, 84, 1269-1276, 2016.
- [29] 王心雨. 基于数字图像处理技术的白麻花岗岩含水率检测. 《无损检测》, 44, 43, 2022.
- [30] 郑金涛. Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. Solar Energy, 231, 343, 2022.