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    大尺寸半导体SiC单晶衬底材料

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    • Project Name:大尺寸半导体SiC单晶衬底材料

    • Institution:晶体材料研究院（晶体材料全国重点实验室）

    • Leading Scientist:徐现刚

    • Supported by:科技部 863

    • Nature of Project:纵向

    • Project Level:National

    • Project Participants:董春明,徐现刚,胡小波,蒋民华,刘宏

    • Project Number:kyxm-28573

    • Project Approval Number:01AA311080

    • Date of Project Approval:2002-01-01

    • Scheduled Completion Time:2004-06-30

    • Date of Project Completion:2004-06-30

    • Date of Project Initiation:2002-01-01

    • Release Time:2019-04-18
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