Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202311605620.3
Number of Inventors:5
Service Invention or Not:no
Application Date:2023-11-29
Publication Date:2024-03-01
Authorization Date:2024-03-01
Application Date: 2023-11-29
Publication Date: 2024-03-01
Authorization Date: 2024-03-01