Hits:
Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202210196597.6
Number of Inventors:8
Service Invention or Not:no
Application Date:2022-03-02
Publication Date:2024-05-28
Authorization Date:2024-05-28
Application Date: 2022-03-02
Publication Date: 2024-05-28
Authorization Date: 2024-05-28