Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202411603552.1
Number of Inventors:5
Service Invention or Not:no
Application Date:2024-11-12
Publication Date:2025-03-07
Authorization Date:2025-03-07
Application Date: 2024-11-12
Publication Date: 2025-03-07
Authorization Date: 2025-03-07