Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202310696789.8
Number of Inventors:8
Service Invention or Not:no
Application Date:2023-06-13
Publication Date:2025-02-11
Authorization Date:2025-02-11
Application Date: 2023-06-13
Publication Date: 2025-02-11
Authorization Date: 2025-02-11