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Title:双极二维全柔性高精度伺服平台
Institution:机械工程学院
Type of Patent:Invent
Application Number:201310545708.0
Number of Inventors:1
Service Invention or Not:No
Application Date:2013-11-06
Publication Date:2015-12-02
Authorization Date:2015-12-02
Release Time:2019-04-15