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Handoko LINEWIH


Gender:Male
School/Department:新一代半导体材料研究院
Date of Employment:2023-02-20
College: Integrated Technical Breakthrough Platform for New-generation Semiconductive Materials
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一种版图结构、半导体器件和其制造方法

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Title:一种版图结构、半导体器件和其制造方法

Institution:新一代半导体材料研究院

Type of Patent:Invent

Application Number:202311576748.1

Number of Inventors:4

Service Invention or Not:No

Application Date:2023-11-24

Publication Date:2024-03-08

Authorization Date:2024-03-08

Release Time:2024-04-02

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