毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [121] GE PEI QI , gaoyufei , biwenbo and 刘腾云. Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing. international Journal of Advanced Manufacturing Technology, 88, 1763, 2017.
- [122] GE PEI QI , gaoyufei , biwenbo and 王沛志. Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw. Materials Science in Semiconductor Processing, 63, 25, 2017.
- [123] GE PEI QI , biwenbo and gaoyufei. KDP晶体金刚石线锯切割表面缺陷分析. 《人工晶体学报》, 42, 1278, 2013.
- [124] gaoyufei , biwenbo and 张磊. Simulation and Prediction Studies on Harden penetration Depth of AISI 5140 Alloy Steel in Surface Grinding. Applied mechanics and materials, 29-32, 1898, 2010.
- [125] GE PEI QI , biwenbo and 王沛志. Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide. Engineering fracture mechanics, 184, 273, 2017.
- [126] GE PEI QI , biwenbo and 段德荣. Numerical study on the heat transfer enhancement and fatigue life by flow-induced vibration. CHEMICAL ENGINEERING RESEARCH & DESIGN, 132, 652, 2018.
- [127] GE PEI QI , biwenbo and 段德荣. Numerical study on fatigue strength and heat transfer enhancement of planar elastic tube bundle. Kung Cheng Je Wu Li Hsueh Pao, 37, 2631, 2016.
- [128] GE PEI QI , biwenbo and 王沛志. The interaction of periodically distributed parallel cracks in anisotropic materials subjected to concentrated loads. Engineering fracture mechanics, 199, 131, 2018.
- [129] GE PEI QI , biwenbo and 刘腾云. Prediction of the thickness for silicon wafers sawn by diamond wire saw. Materials Science in Semiconductor Processing, 71, 133, 2017.
- [130] GE PEI QI , biwenbo and 刘腾云. Fracture strength of silicon wafers sawn by fixed diamond wire saw. Solar Energy, 157, 427, 2017.