刘秀忠山东大学主页平台管理系统--中文主页

论文成果

[1] 杨敏 and 刘秀忠. Thermo-mechanical interaction between aluminum alloy and tools with different profiles during fri.... transactions of nonferrous metals society of china, 29, 495, 2019.
[2] 杨敏 and 刘秀忠. Microstructure and property of Sn-Zn-Cu-Bi lead free solder . ICEPT-HDP 2010, 789, 2010.
[3] 刘秀忠. Microstructure and characteristics of soldering joint interfacial region of ZA alloy. Advanced Materials Research（CMS 2011）, 0, 268, 2011.
[4] 杨敏 and 刘秀忠. Microstructure and mechanical properties of AL/ALN surface composite fabricated via multi-pass fr.... Applied mechanics and materials, 490-491, 192, 2014.
[5] 刘秀忠 and 杨敏. Microstructure and property of Sn-Zn-Cu-Bi lead free solder . ICEPT-HDP 2010, 789, 2010.
[6] 杨敏 and 刘秀忠. Development of Sn-Zn-Cu Lead Free Solder . ICEPT-HDP 2010, 784, 2010.
[7] 杨敏 and 刘秀忠. Development of fluxes for selected Sn-Cu based lead-free solders . 2005 6th International Conference on Electronics Packaging Technology, 258, 2005.
[8] 刘秀忠 and 杨敏. Microstructure and mechanical properties of AL/ALN surface composite fabricated via multi-pass fr.... Applied mechanics and materials, 490-491, 192, 2014.
[9] 刘秀忠 and 杨敏. Microstructure and property of Sn-Zn-Cu-Bi lead free solder . ICEPT-HDP 2010, 789, 2010.
[10] 刘秀忠 and 杨敏. Development of Sn-Zn-Cu Lead Free Solder . ICEPT-HDP 2010, 784, 2010.

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刘秀忠

教授

性别：女

在职信息：在职

所在单位：材料科学与工程学院

入职时间： 1995-08-01

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