Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202310430500.8
Number of Inventors:8
Service Invention or Not:no
Application Date:2023-04-18
Publication Date:2024-06-11
Authorization Date:2024-06-11
Application Date: 2023-04-18
Publication Date: 2024-06-11
Authorization Date: 2024-06-11