Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202110855731.4
Number of Inventors:10
Service Invention or Not:no
Application Date:2021-07-28
Publication Date:2024-03-22
Authorization Date:2024-03-22
Application Date: 2021-07-28
Publication Date: 2024-03-22
Authorization Date: 2024-03-22