杨春凤
-
工程师
- 性别:女
- 在职信息:在职
- 所在单位:机械工程学院
- 入职时间: 2003-07-16
访问量:
-
[1]
姜千青.
Analysis of crack initiation load and stress field in double scratching of single crystal gallium n.
Engineering fracture mechanics,
2022.
-
[2]
葛培琪.
基于机械综合实验的团队教学改革与实践.
实验室研究与探索中文核心期刊,
33,
205-208,
2014.
-
[3]
蒲天钊.
Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing po.
international Journal of Advanced Manufacturing Technology,
7711,
2022.
-
[4]
程大猛.
Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline si.
Materials Science in Semiconductor Processing,
106602,
2022.
-
[5]
刘润涛.
Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid .
Journal of Materials Science: Materials in Electronics,
33,
3676,
2022.
-
[6]
刘润涛.
Surface properties of diamond wire sawn photovoltaic mc-Si wafers by stirred slurry pretreated and a.
SURFACE TOPOGRAPHY-METROLOGY AND PROPERTIES,
10,
2022.
-
[7]
Yihe Liu.
Analysis of sawing characteristics of fine diamond wire slicing multicrystalline silicon.
Diamond and Related Materials,
108708,
2021.
-
[8]
张磊.
Research on material removal mechanism and radial cracks during scribing single crystal gallium nitr.
Ceramics International,
47,
15155,
2021.
-
[9]
张磊.
An analytical model for estimation of the stress field and cracks caused by scratching anisotropic s.
Materials Science in Semiconductor Processing,
2021.
-
[10]
张磊.
Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutti.
Semiconductor Science and Technology,
35,
2020.
-
[11]
尹佑康.
Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle.
CERAMICS INTERNATIONAL Journal,
47,
26627,
2021.
-
[12]
刘雪飞.
齿轮轴的设计制造与检测综合实验模块化教学研究.
《工具技术》,
2021.
-
[13]
杨春凤.
几何量公差与检测实验教学改革的研究.
中国机械,
239,
2014.
-
[14]
张磊 and 杨春凤.
Analysis of Grinding Parameters on Hardness Layer Depth.
Applied mechanics and materials,
37-38,
131,
2010.
-
[15]
杨春凤 and 张磊.
Analysis of Grinding Parameters on Hardness Layer Depth.
Applied mechanics and materials,
37-38,
131,
2010.
-
[16]
杨春凤 and 张磊.
Analysis of Grinding Parameters on Hardness Layer Depth.
Applied mechanics and materials,
37-38,
131,
2010.
-
[17]
杨春凤.
几何量公差与检测实验教学改革的研究.
中国机械,
239,
2014.