毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [81] GE PEI QI , biwenbo and 刘腾云. Fracture strength of silicon wafers sawn by fixed diamond wire saw. Solar Energy, 157, 427, 2017.
- [82] GE PEI QI , gaoyufei and biwenbo. KDP晶体杂质对生长及出槽应力分布的影响. 《人工晶体学报》, 41, 1180, 2012.
- [83] gaoyufei , GE PEI QI and biwenbo. SiC单晶线锯切片及电镀锯丝制造技术的研究进展. 河北科技大学学报, 34, 494, 2013.
- [84] gaoyufei , GE PEI QI , zhanglei and biwenbo. 表面磨粒群螺旋排布电镀锯丝制造的实验研究. 河北科技大学学报, 37, 527, 2016.
- [85] biwenbo. 树脂结合剂固结磨粒线锯涂层材料正交试验分析. 金刚石与磨料磨具工程, 2016.
- [86] biwenbo , gaoyufei and GE PEI QI. Wire tension force variable universe fuzzy control in fixed abrasive wire saw manufacture. Applied Mechanics Materials, 716-717, 658, 2014.
- [87] GE PEI QI , gaoyufei and biwenbo. Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing. Advanced Materials research, 1027, 28, 2014.
- [88] gaoyufei , GE PEI QI and biwenbo. KDP晶体金刚石线锯切割表面缺陷分析. 《人工晶体学报》, 42, 1278, 2013.
- [89] GE PEI QI , gaoyufei and biwenbo. KDP晶体锯切应力场与初始内应力场的耦合分析. 《人工晶体学报》, 42, 1504, 2013.
- [90] biwenbo , gaoyufei , Zhu Zhenjie and GE PEI QI. Development of the manufacture equipment for resin bonded diamond abrasive wire saw. Advanced Materials research, 588-589, 1694, 2012.